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Samsung Semiconductor - K4UHE3D4AA-GUCL

KEY Part #: K7359755

[25313pcs Stock]

    Part Number:
    K4UHE3D4AA-GUCL
    Manufacturer:
    Samsung Semiconductor
    Detailed description:
    24 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 125 °C 200FBGA Mass Production.
    Manufacturer's standard lead time:
    In stock
    Shelf life:
    One Year
    Chip From:
    Hong Kong
    RoHS:
    Payment method:
    Shipment way:
    Family Categories:
    KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : HBM Flarebolt, GDDR6, GDDR5, DDR4, LPDDR4, LPDDR4X, SLC Nand and MODULE ...
    Competitive Advantage:
    We specialize in Samsung Semiconductor K4UHE3D4AA-GUCL electronic components. K4UHE3D4AA-GUCL can be shipped within 24 hours after order. If you have any demands for K4UHE3D4AA-GUCL, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4UHE3D4AA-GUCL Product Attributes

    Part Number : K4UHE3D4AA-GUCL
    Manufacturer : Samsung Semiconductor
    Description : 24 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 125 °C 200FBGA Mass Production
    Series : DDR3

    Latest News

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    Samsung Now Mass Producing Industry’s Most Advanced 4Gb DDR3, Using 20 Nanometer Process Technology
    Samsung Now Producing Four Gigabit LPDDR3 Mobile DRAM, Using 20nm-class Process Technology
    How Will 5G Impact on Memory?
    Samsung Begins Mass Production of Industry’s First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones
    Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
    Samsung Launches Industry’s First 12Gb LPDDR4 DRAM
    High Bandwidth Memory is Catching on for Data-intensive Computing
    Driving the Artificial Intelligence Evolution with In-Memory Computing
    Autonomous Driving and the Quest for Safety
    Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards
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